Exploring multilateral platforms for cross-border payments
BIS, Committee on Payments and Market Infrastructures, Innovation Hub, International Monetary Fund, World Bank Group
| Year of publication: |
January 2023
|
|---|---|
| Institutions: | Bank für Internationalen Zahlungsausgleich / Committee on Payments and Market Infrastructures (issuing body) ; Internationaler Währungsfonds (issuing body) ; Weltbankgruppe (issuing body) |
| Publisher: |
[Basel] : Bank for International Settlements |
| Subject: | Internationaler Zahlungsverkehr | International payments | Digitale Plattform | Digital platform | Kosten-Nutzen-Analyse | Cost-benefit analysis | Welt | World |
freely available
| Extent: | 1 Online-Ressource (circa 32 Seiten) Illustrationen |
|---|---|
| Type of publication: | Book / Working Paper |
| Type of publication (narrower categories): | Graue Literatur ; Non-commercial literature |
| Language: | English |
| ISBN: | 978-92-9259-625-5 |
| Source: | ECONIS - Online Catalogue of the ZBW |
Persistent link: https://www.econbiz.de/10013502616